Title:
SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2020076155
Kind Code:
A
Abstract:
To provide a silver-coated copper powder excellent in storage stability (reliability) and to provide a method for producing the silver-coated copper powder.SOLUTION: A silver-coated copper powder produced by coating a surface of copper powder produced by an atomization method or the like with a silver-containing layer comprising 5 mass% or more (based on a silver-coated copper powder) of silver or a silver compound is added to a solution for supporting silver comprising a solution of silver potassium cyanide (or a silver potassium cyanide to which at least one kind selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is added) to support 0.01 mass% or more (based on a silver-coated copper powder) of silver on the surface of the copper powder coated with the silver-containing layer.SELECTED DRAWING: Figure 1
Inventors:
NOGAMI TOKUAKI
KAMIGA HIROSHI
KAMIGA HIROSHI
Application Number:
JP2020012301A
Publication Date:
May 21, 2020
Filing Date:
January 29, 2020
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/17; C23C18/42; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Attorney, Agent or Firm:
Koichi Okawa