Title:
SILVER COATED COPPER POWDER PRODUCTION METHOD AND CONDUCTIVE PASTE PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2017110299
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a production method in which a silver coated copper powder suitable as metal powder for wiring material can be industrially mass produced; and in addition, using said silver coated copper powder, a method for producing a conductive paste that can cope with the thinning of wiring.SOLUTION: In the production method in which: a copper sulfate aqueous solution, a pH adjuster and a dispersant are mixed to prepare a copper salt solution; a reducing agent aqueous solution is added to the copper salt solution to form copper particles as a reaction mixture; the obtained copper particles are dispersed in a silver salt aqueous solution in order to carry out a silver coat treatment; and the filtering, washing and drying are carried out to make a silver coated copper powder, a metal salt of 0.005 mol% or more and less than 2 mol% with respect to copper for nucleation is dissolved in the copper salt solution as well as at least copper hydroxide is present in the reaction solution. By this method, a silver coated copper powder having a spherical shape, an average particle size of primary particle of 0.1 to 3.0 μm as well as a narrow distribution of the particle size is obtained.SELECTED DRAWING: Figure 1
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Inventors:
NISHIMOTO HIROMU
KANEKO ISAO
KANEKO ISAO
Application Number:
JP2016239053A
Publication Date:
June 22, 2017
Filing Date:
December 09, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
B22F1/02; B22F1/00; B22F9/24; H01B13/00
Attorney, Agent or Firm:
Kazuya Nishi
Usami Aya
Usami Aya