Title:
銀被覆金属粉末およびその製造方法並びに導電性塗料
Document Type and Number:
Japanese Patent JP7335768
Kind Code:
B2
Abstract:
To provide a high-performance silver-coated metal powder that prevents electroconductivity of an electroconductive film from changing with time if the metal powder is used as an electroconductive filler.SOLUTION: This invention relates to a silver-coated metal powder, which is a powder comprising meal particles having: metal core particles each having a copper content of 80 mass% or more; and coating layers each comprising silver and coating the metal core particles, where with regard to a surface leveled by tapping the powder, an A value of formula (1): A=L*/a*/(D50^1.45) is 4.0 or more, the formula (1) being expressed with: L* and a* in the CIE 1976 L*a*b* color space, measured by a regularly reflected light-removing mode with a color difference meter; and a cumulative 50% particle diameter D50(μm) in a volume-based grain size distribution, measured by a laser diffraction/scattering method for the powder.SELECTED DRAWING: None
Inventors:
Kazuhiro Matsumoto
Kyozo Masuda
Kenichi Inoue
Kyozo Masuda
Kenichi Inoue
Application Number:
JP2019178732A
Publication Date:
August 30, 2023
Filing Date:
September 30, 2019
Export Citation:
Assignee:
DOWA Electronics Co., Ltd.
International Classes:
B22F1/00; B22F1/17; B22F9/00; C22C9/00; C22C9/04; C22C9/06; H01B1/22
Domestic Patent References:
| JP2018040056A | ||||
| JP2015105406A | ||||
| JP2000248303A | ||||
| JP2004052044A |
Attorney, Agent or Firm:
Taka Komatsu
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