Silver covering copper alloy powder and a manufacturing method for the same

Title:

Silver covering copper alloy powder and a manufacturing method for the same

Document Type and Number:

Japanese Patent JP5934829

Kind Code:

B2

Abstract:

A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt% of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D 50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 µm), with 7 to 50 wt% of a silver containing layer, preferably a layer of silver or an silver compound.

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Inventors:

Kenichi Inoue
Kozo Ogi
Atsushi Ehara
Hiyama Yuuto
Yudai Yamada
Toshihiko Ueyama

Application Number:

JP2015173427A

Publication Date:

June 15, 2016

Filing Date:

September 03, 2015

Export Citation:

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