Title:
Silver covering copper alloy powder and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6186197
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a silver-coated copper alloy powder enabling a conductive film having an excellent storage stability (reliability) and a low volume resistivity to be formed, and method for producing the same.SOLUTION: The silver-coated copper alloy powder containing 0.1 to 5 mass% of carbon and having a tap density of 3.8 g/cmor more and a proportion of the tap density to the true density of 42 to 55% is obtained by: coating a copper alloy powder that has a composition containing at least one of 1 to 50 mass% of nickel and zinc, and the remainder comprising copper and inevitable impurities, with a 7 to 50 mass% (with respect to the silver coated copper alloy powder) silver-containing layer (layer comprising silver or silver compound); then surface-treating the silver-containing layer-coated copper alloy powder using a surface treating agent.
Inventors:
Kenichi Inoue
Atsushi Ehara
Akihiro Asano
Yudai Yamada
Hideyuki Fujimoto
Kozo Ogi
Atsushi Ehara
Akihiro Asano
Yudai Yamada
Hideyuki Fujimoto
Kozo Ogi
Application Number:
JP2013147953A
Publication Date:
August 23, 2017
Filing Date:
July 16, 2013
Export Citation:
Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F1/02; B22F1/00; C22C9/04; C22C9/06; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
| JP3078906A | ||||
| JP62179566A | ||||
| JP61067702A | ||||
| JP2012167337A | ||||
| JP2006161081A | ||||
| JP2012256580A | ||||
| JP63081706A | ||||
| JP4080303A | ||||
| JP2002332501A |
Attorney, Agent or Firm:
Koichi Okawa
Previous Patent: A device and a method of managing electric power based on data
Next Patent: CARBON DIOXIDE SENSOR
Next Patent: CARBON DIOXIDE SENSOR