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Title:
Silver dust, a manufacturing method for the same, and conductive paste
Document Type and Number:
Japanese Patent JP6029720
Kind Code:
B2
Abstract:
A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.

Inventors:
Taro Nakanoya
Hiroshi Kaga
Application Number:
JP2015146622A
Publication Date:
November 24, 2016
Filing Date:
July 24, 2015
Export Citation:
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Assignee:
dowa Electronics Co., Ltd.
International Classes:
B22F1/052; B22F1/10; B22F1/102; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
JP2005042174A
JP2011052300A
JP2012214873A
JP11317112A
JP2003262949A
JP2008223096A
JP2012046779A
JP2010229544A
JP2011032509A
JP2007016258A
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda