Title:
SILVER ELECTROPLATING BATH AND METHOD
Document Type and Number:
Japanese Patent JPH0499890
Kind Code:
A
Abstract:
PURPOSE:To enable superior high-speed selective Ag electroplating at low concn. of Ag with laser without using a toxic cyanogen compd. by specifying the concn. of Ag in an Ag electroplating bath and adding a specified amt. of citric acid to the bath. CONSTITUTION:The concn. of Ag in an Ag electroplating bath is regulated to 10-100g/l and citric acid is added to the bath by 20-200g/l. A body to be partially plated is put in the resulting bath, the part of the body to be plated is irradiated with laser light and the irradiated part is selectively plated. Bright Ag electroplating can be carried out without using a cyanogen compd. and superior high-speed selective Ag electroplating can be carried out at low concn. of Ag with laser.
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Inventors:
OMI YUJI
ISHIKAWA FUTOSHI
ISHIKAWA FUTOSHI
Application Number:
JP21455790A
Publication Date:
March 31, 1992
Filing Date:
August 13, 1990
Export Citation:
Assignee:
NIPPON DENSO CO
International Classes:
C25D3/46; C25D5/02; (IPC1-7): C25D3/46; C25D5/02
Attorney, Agent or Firm:
Adachi Tsutomu
Next Patent: JPH0499891