PURPOSE: To adapt a contact material to various circuits and to eliminate its abnormal consumption caused by lamelar deposits, faults or the like by dispersing the oxides of Sb, Cu, In, Sn, etc., into Ag.
CONSTITUTION: A silver oxides series contact material is formed by dispersing, as metallic components, an Sb oxide, by weight, 0.1 to 6.2%, a Cu oxide and an In oxide, 0.05 to 5%, an Sn oxide, 0.05 to 5%, as well as a Te oxide, 0.01 to 2%, into silver as essential components. If required, 0.01 to 0.5% of one or more kinds among the oxides of Fe, Ni and Co are furthermore dispersed therein. By compositely adding the above oxides to Ag, the supply of effective components to the surface layer is satisfactorily executed, by which the effect on the prevention of lamelar deposition can be obtd.
NARA TAKASHI
SATO SADAO
SAGARA YASUHIRO
JPS58110639A | 1983-07-01 | |||
JPS6318027A | 1988-01-25 | |||
JPS62158839A | 1987-07-14 |