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Patent Searching and Data


Title:
SILVER PASTE
Document Type and Number:
Japanese Patent JPH11339560
Kind Code:
A
Abstract:

To provide silver paste that suppresses diffusion of silver into an insulation layer when it is used for a conductive layer while keeping the feature of the silver material that is less expansive with low resistance.

In this silver paste, silver powder or allow powder containing silver as the main ingredient to which boric acid is stuck is diffused in an organic vehicle. The quantity of the boric acid is preferably 0.005-5.0 pts.wt., when calculated in terms of boron atoms, per 100 pts.wt. of the silver powder or the alloy powder containing silver as the main ingredient.


Inventors:
Ikeda, Tetsuya
Application Number:
JP1998000148850
Publication Date:
December 10, 1999
Filing Date:
May 29, 1998
Export Citation:
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Assignee:
MURATA MFG CO LTD
International Classes:
H01B1/22; (IPC1-7): H01B1/22