Title:
SILVER PLATED MATERIAL AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2016204719
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a silver plated material which can prevent increase in contact resistance while maintaining high hardness, and a method of producing the same.SOLUTION: A silver plated material is produced by a process in which: in a silver plating solution comprising silver 80-130 g/L, potassium cyanide 60-130 g/L, selenium 30-80 mg/L, and potassium carbonate 50-190 g/L, electroplating is performed at solution temperature of 10-50°C and in current density of 3-12A/dm, a surface layer comprising silver is formed on a material.SELECTED DRAWING: None
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Inventors:
SADAMORI TOSHIKI
ARAKI HISATOSHI
SHINOHARA KEISUKE
MIYAZAWA HIROSHI
ARAKI HISATOSHI
SHINOHARA KEISUKE
MIYAZAWA HIROSHI
Application Number:
JP2015090177A
Publication Date:
December 08, 2016
Filing Date:
April 27, 2015
Export Citation:
Assignee:
DOWA METALTECH KK
International Classes:
C25D5/12; C25D3/46; C25D7/00; H01H1/025; H01H1/04; H01H11/04; H01R13/03
Domestic Patent References:
| JP2015054979A | 2015-03-23 | |||
| JP2010180425A | 2010-08-19 | |||
| JP2015030892A | 2015-02-16 | |||
| JPS62247094A | 1987-10-28 |
Foreign References:
| WO2014199547A1 | 2014-12-18 |
Other References:
齋藤 明夫: "高濃度シアン化銀浴からの厚付け銀めっき", 表面技術, vol. 第４３巻，１１号, JPN6018040705, 1992, pages 1053 - 1058, ISSN: 0003899432
Attorney, Agent or Firm:
Koichi Okawa