To provide a simple exchange type vacuum sensor which has no need of replacing the entire vacuum sensor with a new vacuum sensor even when a pressure detecting element easy to be damaged by the measuring environment is broken in the vacuum sensor for measuring the pressure in a vacuum apparatus for use in manufacturing electronic components or semiconductor products.

The vacuum sensor is connected through a connecting part at one end of a sensor case to the vacuum apparatus the pressure of which is to be measured, a pressure detector connected to an electric circuit for measuring the pressure of the vacuum apparatus is disposed at the other end of the sensor case, the pressure detector having the shortest life in the vacuum sensor is formed on a board, the board with the pressure detector formed thereon is removably disposed at the other end of the sensor case, the vacuum seal of the vacuum sensor is held when the board is mounted on the other end of the sensor case, and the electric connection of the electric circuit to the pressure detector formed on the board can be automatically made.