To provide a simple photoresist coating and drying method wherein photoresist can be safely spread at a low cost and dried without contaminating the apparatus for drying.

Photoresist is accommodated in a vessel 2, a wafer 3 is soaked in the photoresist in the vessel 2, and a film of the photoresist is formed on the surface of the wafer 3. The wafer 3 taken out from the vessel 2 is mounted on at least three upright needle-shaped protrusions 4. The film of the photoresist is dried by heating the wafer 3 from below.