To change a flow rate of a simulated gas to be supplied to a test object while suppressing a temperature variation of the simulated gas to be supplied to the test object.
A simulated gas supply device includes: a first gas supply path 2; a first gas heating part 4 that is connected with the first gas supply path 2 and heats the first gas supplied through the first gas supply path 2; a simulated gas supply path 6 that supplies the test object with the simulated gas generated by heating by the first gas heating part 4; and a simulated gas discharge path 7 that discharges the simulated gas outside, without supplying the test object with the simulated gas generated by heating by the first gas heating part 4. The simulated gas supply device controls a discharge flow rate of the simulated gas through the simulated gas discharge path 7, to adjust a supply flow rate of the simulated gas supplied from the simulated gas supply path 6 to the test object.
JPH10319006A | 1998-12-04 | |||
JP2004195367A | 2004-07-15 | |||
JP2005016472A | 2005-01-20 | |||
JP2009219948A | 2009-10-01 | |||
JP2005523396A | 2005-08-04 | |||
JP2003126658A | 2003-05-07 | |||
JP2002116116A | 2002-04-19 |
Akiko Sato
Saito Shindai
Next Patent: METHOD AND APPARATUS FOR MEASURING VOLTAGE OF ELEMENT TO BE INSPECTED