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Patent Searching and Data


Title:
SIMULATED GAS SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2013104694
Kind Code:
A
Abstract:

To change a flow rate of a simulated gas to be supplied to a test object while suppressing a temperature variation of the simulated gas to be supplied to the test object.

A simulated gas supply device includes: a first gas supply path 2; a first gas heating part 4 that is connected with the first gas supply path 2 and heats the first gas supplied through the first gas supply path 2; a simulated gas supply path 6 that supplies the test object with the simulated gas generated by heating by the first gas heating part 4; and a simulated gas discharge path 7 that discharges the simulated gas outside, without supplying the test object with the simulated gas generated by heating by the first gas heating part 4. The simulated gas supply device controls a discharge flow rate of the simulated gas through the simulated gas discharge path 7, to adjust a supply flow rate of the simulated gas supplied from the simulated gas supply path 6 to the test object.


Inventors:
OKADA YOICHI
Application Number:
JP2011246867A
Publication Date:
May 30, 2013
Filing Date:
November 10, 2011
Export Citation:
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Assignee:
HORIBA LTD
International Classes:
G01M15/10; F01N3/00; F01N3/24; G01N1/00; B01D53/94
Domestic Patent References:
JPH10319006A1998-12-04
JP2004195367A2004-07-15
JP2005016472A2005-01-20
JP2009219948A2009-10-01
JP2005523396A2005-08-04
JP2003126658A2003-05-07
JP2002116116A2002-04-19
Attorney, Agent or Firm:
Ryuhei Nishimura
Akiko Sato
Saito Shindai