To accurately measure an axial direction alignment of a grinding position in a DDG (Double Disc Grinding) grinding device.

In a method for correcting a grinding spindle position in a double-side grinding machine for simultaneous double-side machining of a semiconductor wafer, two grinding spindles having grinding disc flanges to receive grinding discs are torsionally connected by a connecting element, and a measuring unit having an inclinometer and two sensors for distance measurement is mounted between two grinding disc flanges instead of the grinding discs. The grinding spindle therefore is located a position substantially between grinding processes and a position arranged together with the mounted grinding disc in this case. The inclinometer and the sensors are used for determining radial direction and axial direction correction values of the axial direction alignment of the two grinding spindles used for symmetrical orientation of the two grinding spindles, while rotating the connected grinding spindles.