Title:
単一熱流束センサ装置
Document Type and Number:
Japanese Patent JP7005513
Kind Code:
B2
Abstract:
The invention describes a single heat flux sensor arrangement (1) comprising a sensor (10) comprising a layer (100) of thermally insulating material, an inner temperature measurement means (S1) arranged at an inner region of the insulating layer (100) and an outer temperature measurement means (S2) arranged at an outer region of the insulating layer (100); an evaluation unit (11) adapted to receive a temperature input from the inner 5 temperature measurement means (S1) and to receive a temperature input from the outer temperature measurement means (S2); and a heating means (12, S2) realized to deliberately raise the temperature of a region of the insulating layer (100). The invention further describes a non-invasive method of measuring a core body temperature (T0) of a subject (3).
Inventors:
Bonhealth Edwin Heraldos Johannus Maria
Brom Antonius Hermanus Maria
Brom Antonius Hermanus Maria
Application Number:
JP2018553396A
Publication Date:
January 21, 2022
Filing Date:
May 18, 2017
Export Citation:
Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
G01K17/20; A61B5/01
Domestic Patent References:
| JP2003075262A | ||||
| JP10103745A | ||||
| JP5779806B2 | ||||
| JP2014142365A | ||||
| JP2013190236A |
Foreign References:
| CN104545823A | ||||
| US4859078 |
Attorney, Agent or Firm:
Fueda Hidesen
Takahiro Igarashi
Takahiro Igarashi
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