Title:
SINTERED COMPACT AND COPPER PASTE
Document Type and Number:
Japanese Patent JP2023152711
Kind Code:
A
Abstract:
To provide a sintered compact having low resistance and oxidation resistance even sintering at lower temperature, and copper paste by which a sintered compact having the above described performance can be manufactured.SOLUTION: A sintered compact contains copper. The sintered compact has a plurality of pores. A compound containing a silicon element and a nitrogen element is present inside the pores. In 13C-NMR spectrum of the compound, peaks having 13C chemical shift value of a peak apex within each range of 59 ppm or more and 62 ppm or less, 50 ppm or more and 53 ppm or less, and 40 ppm or more and 43 ppm or less are observed, and a mass ratio Si/N between the silicon element and the nitrogen element contained in the compound is 0.5 or more and 3.0 or less.SELECTED DRAWING: None
Inventors:
FUKUSATO SHUN
MARUYAMA YOHEI
INAGAKI YUGO
IMAMURA HIROSHI
KAMIKOORIYAMA YOUICHI
MARUYAMA YOHEI
INAGAKI YUGO
IMAMURA HIROSHI
KAMIKOORIYAMA YOUICHI
Application Number:
JP2023018466A
Publication Date:
October 17, 2023
Filing Date:
February 09, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD
International Classes:
C22C1/05; B22F1/00; B22F1/12; B22F3/11; B22F7/08; B22F9/00; C22C1/04; C22C1/047; C22C1/08; H01L21/52; H05K3/32
Attorney, Agent or Firm:
Patent Attorney Showa International Patent Office
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