Title:
焼結体、ヒートシンク、焼結体の製造方法及びヒートシンクの製造方法
Document Type and Number:
Japanese Patent JP7299183
Kind Code:
B2
Abstract:
To provide a sintered body, a heat sink, a method for producing a sintered body and a method for producing a heat sink that can achieve improved thermal conductivity.SOLUTION: A sintered body CUD1 has a sintered copper member 51, a plurality of diamond particles 10 dispersed in the copper member 51, and a self-organizing monomolecular film formed between each diamond particle 10 and the copper member 51. In the sintered body CUD1, a functional group of the self-organizing monomolecular film on the copper member 51 side may contain CH3.SELECTED DRAWING: Figure 12
Inventors:
Junichiro Shiomi
Forgiveness
Hideyuki Murayama
Forgiveness
Hideyuki Murayama
Application Number:
JP2020038375A
Publication Date:
June 27, 2023
Filing Date:
March 06, 2020
Export Citation:
Assignee:
National University Corporation The University of Tokyo
TOYOTA JIDOSHA KABUSHIKI KAISHA
TOYOTA JIDOSHA KABUSHIKI KAISHA
International Classes:
C01B32/28; C22C1/05; C22C26/00; H01L23/373; H05K7/20
Domestic Patent References:
| JP2012121765A | ||||
| JP2012241255A |
Foreign References:
| CN103075719A | ||||
| WO2019083986A1 |
Attorney, Agent or Firm:
Ken Ieiri
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