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Patent Searching and Data


Title:
SINTERED DIAMOND DIE FOR DRAWING OF BRASS PLATED STEEL WIRE AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPS5791821
Kind Code:
A
Abstract:

PURPOSE: To obtain a superior wire surface without sticking brass on a die obtained by sintering diamond of prescribed grain sizes and volume, carbide, nitride, etc. of IVa group, Va group, VIa group and a prescribed volume of iron group metal.

CONSTITUTION: 20W70vol% diamond having ≤30μm grain sizes, carbide, nitride, boride of IVa group, Va group, VIa group metals and their solid solns. or mixture crystals, and ≤10% iron group metal are mixed. Such mixed powders are sintered in such a way that the diamond particles do not bind to each other, whereby a sintered body having ≤9×104kg/cm2 Young's modulus is obtained. At the time of drawing a brass plated steel wire with the die made of this sintered body, the brass does not stick to the die and the drawn wire of a beautiful wire surface is obtained.


Inventors:
NAKAI TETSUO
YATSU SHIYUUJI
HARA AKIO
Application Number:
JP16864380A
Publication Date:
June 08, 1982
Filing Date:
November 29, 1980
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B21C3/02; C04B35/52; C22C1/05; C22C26/00; C22C29/00; C22C29/16; (IPC1-7): B21C3/02; C04B35/52; C04B41/14; C22C1/05; C22C29/00