PURPOSE: To obtain sintered glass powder having high density and low dielectric constant and useful as a multi-layer printed circuit board, low-resistance metallic material, etc., by crushing a glass having a specific composition, forming the powder and sintering the formed glass powder.

CONSTITUTION: Glass raw materials are compounded to form a principal composition consisting of 40(wt)%≤SiO2≤60%, 10%≤Al2O3≤30% and 20%≤MgO≤40% and 10W30% of the MgO is made to be substituted with one or more kinds of metal oxides selected from SrO, CaO and BaO. The obtained raw material mixture is melted in a crucible at about 1,500°C. The molten mixture is thrown into water to obtain frit, which is crushed to powder having an average particle diameter of 1W10μm. The powder is kneaded in the presence of toluene, etc., formed to a sheet, etc., heated at 875W1,000°C spending about 5hr and sintered by keeping the above state for about 3hr.