Title:
SINTERING DEVICE AND METHOD OF MANUFACTURING SINTERED BODY
Document Type and Number:
Japanese Patent JP2013130315
Kind Code:
A
Abstract:
To provide a sintering device that can prevent influence of a change in quality on an outer surface of a die and stably measure temperature, and to provide a method of manufacturing a sintered body using the same.
The sintering device includes: the die for accommodating a processing object, and having a hole that extends from an outer side surface toward an inside direction; a pressurizing member for applying a pressure on the processing object in the die; and a heating part for heating the processing object in the die.
Inventors:
ADACHI KEN
YANAGAWA SHUSAKU
YANAGAWA SHUSAKU
Application Number:
JP2011278267A
Publication Date:
July 04, 2013
Filing Date:
December 20, 2011
Export Citation:
Assignee:
SONY CORP
International Classes:
F27B17/00; B22F3/14; B30B11/02; F27D21/00
Attorney, Agent or Firm:
Patent Business Corporation Tsubasa International Patent Office