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Title:
SIZED CUTTING METHOD FOR HEAT SINK MATERIAL, AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2001293616
Kind Code:
A
Abstract:

To provide a cutting method that can cut a substrate part 1 of a heat sink material M accurately and quickly to a length required for a heat sink m as a product.

A stopper 6 is used to abut the root portion of a leading fin 2a in a leading fin group 3 in a reference position beyond a cutting position CP from the forward side thereof in a heat sink material feed direction and thus limit a leading fin-side reference length α of the substrate part 1. A pusher 7 is used to push the heat sink material M so that the stopper 6 abuts the root portion of the leading fin 2a. With the stopper 6 first positioned in the reference position, the pusher 7 causes the stopper 6 to abut the root portion of the leading fin 2a of the leading fin group 3, and the leading fin 2a side is cut away, after which the heat sink material M is fed by a given length L and a trailing fin 2b side is cut off. The process is thereafter repeated.


Inventors:
TSUNE YOSHITAKA
Application Number:
JP2000115543A
Publication Date:
October 23, 2001
Filing Date:
April 17, 2000
Export Citation:
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Assignee:
TSUNE SEIKI KK
International Classes:
B23D47/04; B23D45/00; B23D45/06; (IPC1-7): B23D47/04; B23D45/06
Attorney, Agent or Firm:
Fujikawa Tadashi



 
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