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Title:
SIZING METHOD AND SIZING DEVICE
Document Type and Number:
Japanese Patent JP2015199082
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sizing technology capable of finishing a roughly molded part of a machine component with a higher degree of precision.SOLUTION: A sizing device 30 for acquiring a secondary molded article by arranging a primary molded article 10 acquired by hot forging between an upper mold 32 and a lower mold 31, and sizing roughly molded parts 11 and 11 provided to the primary molded article 10 includes a sizing part 57 for sizing the roughly molded parts 11 and 11 in the upper mold 32 and a flow channel 46 to allow an excess material to flow in the lower mold 31. Since the excess material is allowed to flow in the flow channel 46, the flow of the material is accelerated by the split flow, and a material rises more positively toward the inner face of the mold. The surface roughness is improved significantly compared with the simple compression in a closed space.

Inventors:
MURATA SHINICHI
MATSUI YASUZUMI
IEKI SHINJI
Application Number:
JP2014078686A
Publication Date:
November 12, 2015
Filing Date:
April 07, 2014
Export Citation:
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Assignee:
MUSASHI SEIMITSU KOGYO KK
International Classes:
B21K1/30; B21J5/02; B21J5/06
Domestic Patent References:
JPH09141380A1997-06-03
JPH09141380A1997-06-03
JP2000140989A2000-05-23
Attorney, Agent or Firm:
Yoichiro Shimoda
Norimasa Shimoda
Katsuhiko Sumiyoshi
Tadanori Masanori
Toshitake Nozaki