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Patent Searching and Data


Title:
SKIN INTEGRAL FOAM MOLDING
Document Type and Number:
Japanese Patent JPH10323844
Kind Code:
A
Abstract:

To prevent invasion of heating steam into a skin material by adhesively integrating a film layer of the material obtained by sequentially laminating a surface layer, a foam layer and the film layer in the state fusion bonded to a front surface of a foam resin base material.

A skin material 2 is constituted by sequentially laminating a surface layer 3, a foam layer 4 and a film layer 5. The layer 3 selects fabric or nonwoven fabric in response to using purpose, and the layer 4 uses vinyl chloride foam or propylene foam. And, as the layer 5, a synthetic resin film of vinyl chloride or polypropylene compatible with the layer 4 is used. The layer 5 is melted by heating at the time of foam molding, fusion bonded to a surface of a foam resin base material 1, and effectively and rigidly adhesively integrated with the material 2. The layer 5 having no air permeability is provided on a lowermost layer of the material 2 to prevent invasion of steam introduced into a cavity into the layers 3 and 4.


Inventors:
IWAI TOSHIHAYA
NARITA KANEHIDE
Application Number:
JP13345797A
Publication Date:
December 08, 1998
Filing Date:
May 23, 1997
Export Citation:
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Assignee:
TAKASHIMAYA NIPPATSU KOGYO
International Classes:
B32B5/18; B29C39/10; B32B27/08; B29K105/04; B29L9/00; B29L31/58; (IPC1-7): B29C39/10; B32B5/18; B32B27/08
Attorney, Agent or Firm:
Akio Najima (2 others)