To prevent chips caused at slicing from adhering again to a cutting plane in a slicing device repeating slicing of the surface of a sample and taking in data on the cutting plane in succession.
A cutter 12 is placed in a working chamber 11. A mouthpiece unit 15 is provided on the bottom 13 of the working chamber 11 and a sample holder 18 is arranged under the mouthpiece unit 15. The top surface of the mouthpiece unit 15 is at higher position than the bottom 13 of the working chamber 11. A sample 10 is held at the sample holder 18 and fed into the working chamber 11 by a fixed amount through the mouthpiece unit 15. The cutter 12 moves in horizontal direction along the top surface of the mouthpiece unit 15. A window 16 for observation is provided on the ceiling of the working chamber 11, and a sensor 19 to detect the state of the cutting plane is arranged above the window 16. Chips 20 caused by the slicing of the sample are accumulated around the mouthpiece unit 15.
OTOMO AKIHIRO
ASANOME YUTAKA
KOKUBO MITSUNORI
HIGUCHI TOSHIRO
KUDO KENICHI
YOKOTA HIDEO
KANAGAWA KAGAKU GIJUTSU AKAD