PURPOSE: To provide a slicing machine enhancing the flatness accuracy of the cut surface due to a blade to enable slicing good in yield.
CONSTITUTION: Blade sensors 11a, 11b detecting the displacement of a blade 4 in the thickness direction thereof are provided in opposed relation to the side surface of the blade 4 and an electromagnet 22 exerting magnetic force on the ingot cutting area of the blade 4 is provided to the end surface on the cut side of an ingot. By forming a predetermined magnetic field by preliminarily operating the electromagnet 22 before the cutting of the ingot, the blade positioned in the ingot cutting area 21 is bent by a predetermined distance and the intensity of the magnetic field of the electromagnet 22 is controlled on the basis of the displacement of the blade 4 during the cutting of the ingot detected by the blade sensors 11a, 11b by a control means 23.
JP6953788 | Wafer manufacturing method and holding jig |
JP2021166278 | CUTTING DEVICE, TRAY, AND TRANSPORT SYSTEM |
JP5614664 | Utility pole cutting method |
TSUCHIYAMA HIROSHI
Next Patent: PRODUCTION OF REFRACTIVE INDEX DISTRIBUTION TYPE LENS