PURPOSE: To prevent a wafer, which is being cut off, from sticking to a blade or being warped by a method wherein at the time of cutting off of an ingot into a thin piece while supplying a coolant liquid to a cutting edge of a rotary blade, the coolant liquid stuck to a boundary between the blade and cutting edge is removed by blowing air against the liquid.
CONSTITUTION: A semiconductor wafer is manufactured by cutting off an ingot 14 by pressing the ingot 14 against an inner circumferential edge 12 of a blade 10 turning at a high speed. After removal of chips stuck to the inner circumferential edge 12 and an inner circumferential part of the blade 10 by a washing coolant liquid to be injected through a nozzle, the cutting coolant liquid is injected to the inner circumferential edge 12. Air nozzles 34 are fitted to both sides of a face of the blade 10 on this side of the nozzle injecting the cutting coolant liquid so that air blown off from injection ports each 36 abuts against boundary parts 20A, 20B of an upper and lower parts of the inner circumferential edge 12 of the blade 10. Therefore, the washing coolant liquid stuck to this part is removed forcibly.
SHIBAOKA SHINJI
HIROSE HITOSHI
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