Title:
SLIP RING ASSEMBLY, SLIP RING DEVICE, AND MANUFACTURING METHOD OF SLIP RING ASSEMBLY
Document Type and Number:
Japanese Patent JP2023165227
Kind Code:
A
Abstract:
To provide an easy-to-assemble slip ring assembly, a slip ring device, and a manufacturing method of the slip ring assembly.SOLUTION: A plurality of annular slip rings 20 made of a conductive material and a plurality of annular insulating rings 24 made of insulating material and having a larger diameter than the slip ring 20 are alternately in the direction of the central axis, a plurality of electric wires 2 for connecting rotating equipment and the slip ring 20 are provided inside the slip ring 20 and the insulating ring 24, circular grooves 24a, 24a are formed on both sides of the insulating ring 24 in the central axis direction, the slip ring 20 is fitted into the groove 24a of the insulating ring 24, and the slip ring 20 and the insulating ring 24 are filled with a resin 30.SELECTED DRAWING: Figure 4
Inventors:
SHIBUKI MASATOSHI
YAMAZAKI TOSHIHARU
YAMAZAKI TOSHIHARU
Application Number:
JP2022076027A
Publication Date:
November 15, 2023
Filing Date:
May 02, 2022
Export Citation:
Assignee:
ENDO KOGYO CO LTD
MIDORI SOKKI KK
MIDORI SOKKI KK
International Classes:
H01R43/00; H01R39/00
Attorney, Agent or Firm:
Patent Attorney Corporation Inoue International Patent and Trademark Office
Yoshio Inoue
Ryuji Ito
Kenichi Aihara
Junko Inoue
Yoshio Inoue
Ryuji Ito
Kenichi Aihara
Junko Inoue
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