Title:
SLIP RING
Document Type and Number:
Japanese Patent JP2019176667
Kind Code:
A
Abstract:
To facilitate assembly when a slip ring is formed by performing multilayer coupling of ring-like conduction plates and ring-like insulating plates.SOLUTION: A slip ring is constituted so that angle positions of an insulating pin (60) inserted into first and second holding holes (22a, 21a) formed by penetrating peripheral edges of the respective ring-like conduction plates (22) and the ring-like insulating plates (21) and the respective projection pieces (31) provided on the respective ring-like conduction plates (22) are different from one another by viewing from an axial direction (A) in the slip ring with: a laminate (34) which is constituted by laminating the ring-like conduction plates (22) and the ring-like insulating plates (21) along the axial direction (A); at least one projection piece (31) which integrally projects inward from through inner holes (30) of the respective ring-like conduction plates (22); and at least one lead wire (24) connected with the respective projection pieces (31).SELECTED DRAWING: Figure 1
Inventors:
WADA SHOGO
Application Number:
JP2018064226A
Publication Date:
October 10, 2019
Filing Date:
March 29, 2018
Export Citation:
Assignee:
TAMAGAWA SEIKI CO LTD
International Classes:
H02K13/00
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Ichiro Oi
Kanayama Asuka
Kajinami order
Ichiro Oi
Kanayama Asuka