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Title:
SLIT COAT TYPE COATING DEVICE AND COATING METHOD
Document Type and Number:
Japanese Patent JP2009172556
Kind Code:
A
Abstract:

To provide a slit coat type coating device and a coating method which are realized at a relatively reduced cost and can form a uniform coating thickness.

The device includes a hold table 20 holding a substrate 1 on the surface of a lower side in a vertical direction, a first liquid vessel 30 arranged facing to the surface of the substrate 1 held by the hold table 20 and storing a predetermined coating solution 2, a coating head 40 held movably in a vertical direction in the first liquid vessel 30 and having a slit type nozzle 41 flowing out a coating solution stored in the first liquid vessel 30 toward the surface of the substrate 1, and a second liquid vessel 50 held movably in a vertical direction and storing the coating solution 2 communicating to the first liquid vessel 30 through a communicating pipe 60; and is provided with a control means controlling the height of the second liquid vessel 50 corresponding to movement of the coating head 40 when coating the substrate 1 with the coating solution 2.


Inventors:
YAMAOKA TAKUSANE
OTA MUTSUHIKO
Application Number:
JP2008016743A
Publication Date:
August 06, 2009
Filing Date:
January 28, 2008
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B05C5/02; B05D1/26
Domestic Patent References:
JPH1176894A1999-03-23
JP2001321710A2001-11-20
JP2003001171A2003-01-07
JP2005152716A2005-06-16
Attorney, Agent or Firm:
Hiroyuki Kurihara
Muranaka



 
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