Title:
SLIT DIE, AND COATING APPARATUS PROVIDED WITH THE SAME
Document Type and Number:
Japanese Patent JP2021186707
Kind Code:
A
Abstract:
To provide a slit die of which a slit width is smaller than a manifold width, and which suppresses settlement of a coating liquid in both end parts in a width direction of a manifold.SOLUTION: A slit die 10 coats a web 2 evenly in a width direction with a coating liquid. The slit die 10 includes a main manifold 17 which extends in the width direction and spreads the coating liquid in the width direction, and a slit 16 which is narrower than the main manifold 17 and coats the web 2 with the coating liquid flowing from the main manifold 17. The main manifold 17 includes non-overlapping parts 24 as parts, which do not overlap the slits 16 in the width direction, respectively in both end parts 17a in the width direction. In the main manifold 17, first inflow parts 19 in which the coating liquid flows in are respectively arranged on the non-overlapping parts 24.SELECTED DRAWING: Figure 3
Inventors:
SHIMADA TAKASHI
ISHIKAWA TETSUYA
ISHIKAWA TETSUYA
Application Number:
JP2020091423A
Publication Date:
December 13, 2021
Filing Date:
May 26, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B05C5/02
Attorney, Agent or Firm:
Maeda patent office