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Patent Searching and Data


Title:
SLITTER DEVICE, AND SLITTER MACHINING METHOD
Document Type and Number:
Japanese Patent JP2012232392
Kind Code:
A
Abstract:

To provide a slitter device capable of preventing peeling or the like during cutting of a transfer ribbon or the like, and to provide a slitter machining method.

The slitter device for cutting a long base material with a prescribed width includes: unwinding means for unwinding a long base material having a transfer layer formed on one surface; a slitter for cutting the long base material with a prescribed width; a conveyance roll for maintaining tension at a contact between the long base material and the slitter; an inversion roll for contact with the slitter on the transfer layer forming surface of the long base material; and winding means for winding the cut long base material. The slitter machining method is characterized in that the slitter device conveys the long base material having the transfer layer formed on one surface while maintaining tension between two conveyance rolls, and bringing the slitter for cutting the roll base material with a prescribed width to cut from the surface of the roll base material, where the transfer layer is formed.


Inventors:
SAITO TAKAHIRO
Application Number:
JP2011104117A
Publication Date:
November 29, 2012
Filing Date:
May 09, 2011
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B26D1/02; B26D7/14