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Patent Searching and Data


Title:
SLITTER DEVICE
Document Type and Number:
Japanese Patent JP2014042944
Kind Code:
A
Abstract:

To achieve labor saving of an operator and highly accurate positioning when changing and adjusting a slit cutting position, and achieve space saving of a slitter device, in the slitter device which cuts slits in an object to be cut by a predetermined number of slitter blades.

A shaft 31 is provided with slitter blades 14-1 to 14-5. A movable shaft 42 arranged parallel to the shaft 31 is provided with a movable chuck part 41 equipped with a movable holding arm 51 movable to the slitter blade side, and provided with a single detection sensor 56, 57 moving integrally with the movable chuck part 41. On the basis of detection of a slitter blade to be moved by the detection sensor 56, 57, the slitter blade to be moved is held and moved by the movable holding arm 51.


Inventors:
MORIYA KOSUKE
MATSUYAMA KAZUMASA
Application Number:
JP2012184862A
Publication Date:
March 13, 2014
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
TOPPAN FORMS CO LTD
International Classes:
B26D7/26; B26D1/24
Domestic Patent References:
JPS59169797A1984-09-25
JPH09239696A1997-09-16
JPS63123695A1988-05-27
JPH0890492A1996-04-09
JPS59169797A1984-09-25
JPS6176300A1986-04-18
Attorney, Agent or Firm:
▲高▼橋 寛