Title:
SLURRY PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2014104570
Kind Code:
A
Abstract:
To provide a slurry processing method whereby a coolant can be recovered with a high recovery percentage and an excellent efficiency from a slurry generated when an ingot comprising silicon is cut by a fixed abrasive grain system.
In a slurry processing method according to the present invention, solid-liquid separation of a slurry S, which is generated an ingot comprising silicon is cut by a fixed abrasive grain wire and a coolant, is carried out. A water-soluble cutting liquid is used as a coolant, and the solid-liquid separation of the slurry is carried by a filter press apparatus.
More Like This:
Inventors:
KAMIYA MASATAKE
HIKI TOMONORI
HIKI TOMONORI
Application Number:
JP2012261760A
Publication Date:
June 09, 2014
Filing Date:
November 29, 2012
Export Citation:
Assignee:
MAKINO KK
International Classes:
B24B55/12; B01D25/12
Attorney, Agent or Firm:
Patent business corporation Patena