SLURRY SUPPLY TANK FOR CMP, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Title:

SLURRY SUPPLY TANK FOR CMP, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2002075930

Kind Code:

A

Abstract:

To provide a slurry supply tank for stably supplying slurry onto a substrate during CMP treatment, and the manufacturing method of a semiconductor device using the supply tank, where the slurry supply tank is a slurry tank that is provided directly before being supplied to the substrate and is used relatively immediately, or a tank for storing slurry for a long time.

A cut-off device 101 for cutting off the gas-liquid interface of chemical liquid such as slurry 100 supplied to the substrate during CMP treatment is provided in the supply tank 103. The generation of bubbles by a surface-active agent in slurry that cause a problem when operating a slurry supply device, the diffusion of such effective constituent as ammonium, and the like are decreased, thus achieving a stable process and hence improving the productivity of the manufacturing process of a semiconductor device or the like.

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Inventors:

MINAMI FUKUGAKU
FUKUSHIMA MASARU
KURASHIMA NOBUYUKI
YANO HIROYUKI

Application Number:

JP2000256599A

Publication Date:

March 15, 2002

Filing Date:

August 28, 2000

Export Citation:

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Assignee:

TOSHIBA CORP

International Classes:

B24B57/02; B24B37/00; H01L21/304; H01L21/306; H01L21/3205; H01L21/321; H01L21/768; (IPC1-7): H01L21/304; B24B37/00; B24B57/02; H01L21/306; H01L21/3205

Attorney, Agent or Firm:

Toshi Takemura

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