Title:
SMALL-DIAMETER HOLE MACHINING METHOD FOR SUBSTRATE MATERIAL AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2625078
Kind Code:
B
Abstract:
PURPOSE: To efficiently remove smear generated in a through-hole bored in a substrate by making the X-axis-Y-axis moving speed of a substrate and/or the scanning speed of an electrode higher at a part where there is no through- hole, and making the same lower or once stopping at a part in the vicinity of a through-hole.
CONSTITUTION: A needle-like electrode scans the surface of a substrate 3 having through-holes l of various sizes while the reciprocating motion is shifted at a fixed gap. The electrode is moved at a higher speed at a part where there is no through-hole, (a), and according to the positional data on the through-hole 1 recorded in a first process, the speed is decreased as it approaches the through-hole l. When it further approaches the through-hole l, the low-speed movement is continued while discharge is started (b). When it passes the through-hole 1, the discharge is ended (c), and the speed is again increased and scanning is performed (d). Thus, in addition to scanning of the electrode, the substrate 3 may be moved in the X-axis-Y-axis direction.
Inventors:
Oba, Kazuo
Shima, Yoshinori
Oba, Akira
Shima, Yoshinori
Oba, Akira
Application Number:
JP1994000059135
Publication Date:
April 11, 1997
Filing Date:
March 29, 1994
Export Citation:
Assignee:
SAKAE DENSHI KOGYO KK
Oba, Kazuo
Shima, Yoshinori
Oba, Akira
Oba, Kazuo
Shima, Yoshinori
Oba, Akira
International Classes:
B23H7/26; B23B49/00; B23H9/02; B23H9/14; B23Q17/24; B26F1/28; H05K3/00; (IPC1-7): B23H9/14; B23B49/00; B23H7/26; B23Q17/24; B26F1/28; H05K3/00