Title:
底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール
Document Type and Number:
Japanese Patent JP5814962
Kind Code:
B2
Abstract:
A disclosed method of manufacturing a camera module includes providing a stack of optical elements, providing an integrated circuit image capture device (ICD) having a top surface with an array of sensors, rigidly attaching the stack of optical elements to top surface of the image capture device, providing a substrate having an opening therethrough and a recess around said opening, and attaching the image capture device to the substrate such that edges of the image capture device are disposed in the recess and the stack of optical elements extends through the opening. The method further includes providing a second substrate (e.g., host PCB) and mounting the substrate on the second substrate to attach the camera module to the host device. Optionally, the substrate is mounted to the second substrate via a reflow solder process.
Inventors:
Sing, harp neet
Application Number:
JP2013043381A
Publication Date:
November 17, 2015
Filing Date:
March 05, 2013
Export Citation:
Assignee:
Nanchang O-Film Optoelectronics Technology Ltd
International Classes:
H04N5/225; G02B3/00; G02B7/02
Domestic Patent References:
| JP2004304605A | ||||
| JP2004328474A | ||||
| JP2004226872A | ||||
| JP2001292354A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Disciple Maru Ken
Ino Sato
Mitsuru Matsushita
Ichiro Kurasawa
Kazushige Tanzawa
Sadao Kumakura
Disciple Maru Ken
Ino Sato
Mitsuru Matsushita
Ichiro Kurasawa
Kazushige Tanzawa