To provide small-sized RF components.
A plurality of components for guiding or controlling RF and microwave radiation are integrated by a plurality of electrodepositions and/or a plurality of laminated materials. The components include a switch, a dielectron an antenna, a transmission line, a filter, a hybrid coupler, an antenna array and/or other active or passive components. The components include a channel that does not allow useful radiated rays to be outputted and input when separating sacrifice materials from composition materials. In a preferred forming process, the electrodeposition mold fabrication technology (e.g., selective deposition, bulk deposition, etching process and flattening process) and post deposition process (e.g., selective etching and/or final backfill process) are employed.
EVANS JOHN D
BANG CHRISTOPHER A
COHEN ADAM L
LOCKARD MICHAEL S
SMALLEY DENNIS R
GROSSER MORTON
JPH03123307A | 1991-05-27 | |||
JPS6185928A | 1986-05-01 | |||
JPH01146401A | 1989-06-08 |
WO2000039854A1 | 2000-07-06 |
Takahiro Miura
Fumihiro Mizuno