Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SMALL WOOD LAMINA FOR WOODEN BOARDS AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2022118558
Kind Code:
A
Abstract:
To obtain a wooden board A having high strength, excellent in dimensional stability and surface properties, and easy to manufacture.SOLUTION: A wooden board A of the invention is formed by laminating and integrating a large number of small wood laminas 1, 1, ... having front and rear surfaces along a fiber direction in an assembled state. Each of the small wood laminas 1, 1, ... constituting the wooden board A uses only one type having a thickness t of 0.05 to 0.35 mm, a fiber direction dimension d1 (length) along the fiber direction is 40 mm or less, and a fiber orthogonal dimension d2 (width) along the direction orthogonal to the fiber direction is equal to or less than 40 mm.SELECTED DRAWING: Figure 3

Inventors:
YASUI MORIHEI
MINAGAWA MASUMI
Application Number:
JP2021015153A
Publication Date:
August 15, 2022
Filing Date:
February 02, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAIKEN CORP
International Classes:
B27M3/00; B27M1/08; B32B21/02
Domestic Patent References:
JP2020023195A2020-02-13
JP2013216049A2013-10-24
JP2016049671A2016-04-11
JPS63114742A1988-05-19
JP2013086472A2013-05-13
JP2004529012A2004-09-24
Foreign References:
US20130074991A12013-03-28
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office



 
Previous Patent: JPWO2022118557

Next Patent: Wood board manufacturing method