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Patent Searching and Data


Title:
SMC HOUSING METHOD
Document Type and Number:
Japanese Patent JPH10296726
Kind Code:
A
Abstract:

To provide a housing method for an SMC(sheet molding compound), capable of controlling the occurrence of wrinkles on a surface of the SMC to a minimum degree, making the SMC to be taken out of a containing box easily, and preventing the SMC from being collapsed during transportation.

A SMC 2 is contained in a zigzag manner in a rectangular containing box 1. In this method, the distance between two faces (distance between A and B faces) of the aforementioned containing box 1, to which coated end faces 4 of the SMC 2 are opposed, are made longer than the width of the coated SMC, and the same number of spacers 3 are respectively inserted into both side spaces between the SMC 2 and the containing box, which are defined by making the distance between the two side faces of the containing box longer. Further, the contact area of the spacers 3 with respect to one side of the SMC 2 is made to at most 2/3 of the area of the face of the containing box, with which the spacers 3 are contacted.


Inventors:
KIMURA TORU
Application Number:
JP10546097A
Publication Date:
November 10, 1998
Filing Date:
April 23, 1997
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B65H1/04; B29B11/16; B29K33/04; B29K105/06; B29L7/00; (IPC1-7): B29B11/16; B65H1/04
Attorney, Agent or Firm:
Kunihiko Wakabayashi