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Title:
SMOOTH LIGHTWEIGHT BOARD MATERIAL
Document Type and Number:
Japanese Patent JP2008179920
Kind Code:
A
Abstract:

To provide a smooth lightweight board having a low density but having nearly uniform resin filling ratio in the direction of thickness, a high resin filling ratio also at the center region to attain excellent bending behavior, free from abrupt stress drop even if being bent beyond a bending level exhibiting maximum bending stress and having excellent surface smoothness and light weight.

The smooth lightweight board material is composed mainly of a nonwoven fiber fabric containing 80-100 mass% wet-heat bondable fiber, has a thickness of 0.5-6.0 mm and an apparent density of 0.2-0.5 g/cm3 and satisfies the requirements that (1) the filling ratio of the fiber resin in the cross-section is 40-80%, (2) the average center-line roughness is 100 m on at least one surface, and (3) the maximum bending stress is 1.0 Pa at least in one direction and the bending stress at the bending level corresponding to 1.5 times the maximum bending stress is 1/3 of the maximum bending stress.


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Inventors:
KIMURA TOMOAKI
ARAIDA YASUAKI
OCHIAI TORU
KIYOOKA SUMIHITO
Application Number:
JP2007015100A
Publication Date:
August 07, 2008
Filing Date:
January 25, 2007
Export Citation:
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Assignee:
KURARAY KURAFLEX CO LTD
International Classes:
A45C5/02; B32B5/02; B32B27/28; D04H1/541; D04H1/544; D04H1/545; D04H1/551
Domestic Patent References:
JPH11277696A1999-10-12
JPS63235558A1988-09-30
JPS5626008A1981-03-13
JP2007002351A2007-01-11
JPS61654A1986-01-06
JPH01168949A1989-07-04
JP2000212868A2000-08-02