Title:
SMOOTH SURFACE WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3514656
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a smooth surface wiring board having a satisfactory heat resistance, chemical resistance and electrical characteristics at a possibly lower heating temperature of less than 250°C.
SOLUTION: A film-like insulator 1 is composed of a thermoplastic resin composition of a temperature rising glass transition temperature of 150-230°C containing a polyaryl ketone resin having a crystal melting peak temperature of 260°C or higher, and an amorphous polyether imide resin, a conductor foil 2 is laminated on the insulator 1 and thermally bonded, so that the thermoplastic resin composition meets the relation between a crystal melting heat quantity ΔHm and the crystallizing heat quantity ΔHc shown by Equation I, conductor circuits 2' are formed, smooth flat plates 7 are laid on the obtained printed wiring board 6 surface and hot pressure bonded, so that an insulation layer 1' satisfies the relation shown by Equation II so that both the insulating layer 1' surface and the conductor circuit 2' surface are at the same height and form a smooth surface. Eq. I: ((ΔHm-ΔHc)/ΔHm)≤0.5, Eq. II: l((ΔHm-ΔHc)/ΔHm)≥0.7.
Inventors:
Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Nomoto, Kaoru
Iwama, Hiroyasu
Takagi, Jun
Taniguchi, Koichiro
Nomoto, Kaoru
Iwama, Hiroyasu
Application Number:
JP8428299A
Publication Date:
March 31, 2004
Filing Date:
March 26, 1999
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
DENSO CORP
DENSO CORP
International Classes:
H05K1/02; C08L71/10; C08L73/00; C08L79/08; H05K1/03; H05K3/22; H05K3/38; (IPC1-7): H05K3/22; C08L71/10; C08L73/00; C08L79/08; H05K1/03; H05K3/38
Attorney, Agent or Firm:
鎌田 文二 （外２名）
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