Title:
Sn-Au ALLOY SOLDER PASTE HAVING REDUCED PRODUCTION OF VOID
Document Type and Number:
Japanese Patent JP2008161913
Kind Code:
A
Abstract:
To provide Sn-Au alloy solder paste having reduced production of voids.
The Sn-Au alloy solder paste is composed of the mixture of Sn-Au alloy solder powder having a componential composition comprising, by mass, 5 to 15% Au, and further comprising any element selected from 0.1 to 10% Bi, 0.1 to 10% In and 0.1 to 10% Sb, and the balance Sn with inevitable impurities, and flux. The mixture has a blended composition composed of 5 to 25% flux, and the balance above Sn-Au alloy solder powder.
Inventors:
ISHIKAWA MASAYUKI
OBINATA MASAYOSHI
MISHIMA TERUSHI
OBINATA MASAYOSHI
MISHIMA TERUSHI
Application Number:
JP2006354116A
Publication Date:
July 17, 2008
Filing Date:
December 28, 2006
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K35/22; B23K35/26; B23K35/363; C22C13/00; B23K35/40
Domestic Patent References:
| JPS54122653A | 1979-09-22 | |||
| JPH0970687A | 1997-03-18 | |||
| JP2006055882A | 2006-03-02 | |||
| JP2000208934A | 2000-07-28 | |||
| JP2003211283A | 2003-07-29 | |||
| JP2006167802A | 2006-06-29 | |||
| JP2004031697A | 2004-01-29 | |||
| JP2003305589A | 2003-10-28 | |||
| JPS561292A | 1981-01-08 |
Attorney, Agent or Firm:
Kazuo Tomita
Kutaro Kamoi
Kageyama Shuichi
Kutaro Kamoi
Kageyama Shuichi
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