To provide the snap-off mechanism of a printing machine which enable a smooth snap-off corresponding to the type of cream solder.

The snap-off mechanism of a cream solder printing machine 10 for a snap-off which demolds cream solder applied on a substrate 20 through the opening part of a mask 1 laid on the substrate 20 from the opening part is provided. By vibrating the mask 1 vertically with the substrate 20 fixed, the adhesion of the solder to the inside of the opening part is reduced to perform the snap-off. By the minute intermittent vertical movement of the mask 1, the adhesion of the solder to the inside of the opening can be reduced for the snap-off. The vertical vibration or intermittent movement of the mask 1 is carried out by a mask lifting mechanism which is arranged in the neighbourhood of the substrate 20 and can lift the mask 1.