PURPOSE: To mount and remove a semiconductor device without use of any tool by displacing a locator by a locator driving member made of a shape memory alloy.
CONSTITUTION: A locator driving member 21 is embodied in an inverted U form, and legs 21a, 21b are fitted fast to the locators 4A, 5A, which are thus coupled together. This member 21 is made of a shape memory alloy, with the shape stored for ex. so that the legs 21a, 21b are a little closed at 70°C (memory temp.). To remove a semiconductor device concerned 11 from a socket 20, it is heated to 70°C in the same manner as at mounting. This heating recovers the shape of the locator driving member 21 to draw the locators 4A, 5A so as to approach each other, and an upward protruding pin 3b is bent, and the contact part 3c is put in the condition apart from a pin terminal 12. Thus mounting and removal of the semiconductor device is made practicable without use of any tool.
OKUYAMA TAKESHI
MIYAZAWA HIDEO
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