To provide a socket capable of shortening a connection distance between a connected object and a mounted substrate by suppressing occurrence of warp.

A socket 10 has a first relay substrate 30, a second relay substrate 40 and a frame 20 fixed to the first relay substrate, and the first relay substrate includes a first conductor layer formed oppositely to a surface confronted to a mounted substrate 110, and a second conductor layer formed oppositely to the mounted substrate. The second relay substrate includes a substrate body having a through-hole, and a connecting terminal which is fixed to the substrate body while being inserted into the through-hole and has a first connecting part protruded from the substrate body to a side of the first relay substrate and a second connecting part protruded from the substrate body to a side of a connected object. The first connecting part is brought into contact with the first conductor layer of the first relay substrate, the second connecting part is brought into contact with a pad of the connected object, and the connected object and the mounted substrate are electrically connected.