Title:
SOFT ETCHING AGENT FOR COPPER AND COPPER ALLOY
Document Type and Number:
Japanese Patent JPS5873776
Kind Code:
A
Abstract:
PURPOSE: To remove a corrosion inhibitor, fat, oil, copper burrs, etc. remaining on a copper surface and to expose uniform copper crystal faces by incorporating prescribed percentages of sodium persulfate and/or potassium persulfate and sulfate and/or hydrogensulfate ions.
CONSTITUTION: The titled soft etching agent contains 80mol sodium persulfate and/or potassium persulfate and 1W20mol sulfate and/or hydrogen-sulfate ions. A corrosion inhibitor, copper burrs, fat, oil and oxide remaining on a copper or copper alloy surface are removed with the etching agent to exposure uniform copper crystal faces. Chemical copper plating with superior adhesive strength is obtd. and copper ions in waste water are easily removed.
Inventors:
KOMATSU YOUICHI
OSHIDA YUTAKA
IKETANI ITARU
TABUCHI MASAO
SATOU YASUHIRO
OSHIDA YUTAKA
IKETANI ITARU
TABUCHI MASAO
SATOU YASUHIRO
Application Number:
JP17360681A
Publication Date:
May 04, 1983
Filing Date:
October 29, 1981
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C23F1/18; H05K3/38; (IPC1-7): C23F1/00
Domestic Patent References:
| JP47047501A |