Title:
SOLDER ALLOY POWDER AND SOLDER PASTE FOR BUMP, AND SOLDER BUMP USING THE SAME
Document Type and Number:
Japanese Patent JP2013237088
Kind Code:
A
Abstract:
To provide solder alloy powder and solder paste for a bump, which can suppress generation of a needle-like protrusion, and to provide a solder bump using the same.
Solder alloy powder for a bump has a component composition containing 2.8-4.2 wt.% Ag and 0.4-0.6 wt.% Cu and also containing 50-500 ppm of Pb and the balance consisting of Sn and unavoidable impurities. A solder paste for a bump is formed by mixing the solder alloy powder with flux together. Furthermore, a solder bump is formed by using the solder alloy powder for the bump.
Inventors:
ISHIKAWA MASAYUKI
UNO HIRONORI
YAMAJI TAKASHI
UNO HIRONORI
YAMAJI TAKASHI
Application Number:
JP2012113040A
Publication Date:
November 28, 2013
Filing Date:
May 17, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23K35/26; B23K1/00; B23K35/22; C22C13/00; H01L21/60; H05K3/34; B23K101/40
Attorney, Agent or Firm:
Hideyuki Sugiura
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