Title:
SOLDER BALL AND SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2012089898
Kind Code:
A
Abstract:
To provide a solder ball in which an underfill part is formed so as to cover the outside of a core part, and a semiconductor package in which a substrate part and a semiconductor chip are electrically connected to each other via the solder ball.
A solder ball 130 for electrically connecting a semiconductor chip 110 and a substrate part 120 includes: a core part 132 for electrically connecting the semiconductor chip 110 and the substrate part 120; and an underfill part 134 applied to the core part 132 so as to cover the outside of the core part 132 for protecting the periphery of the core part 132 when the semiconductor chip 110 and the substrate part 120 are brought into contact with each other in the core part 132.
Inventors:
KIM WOON-CHUN
CHIN KENSHO
YIM SOON GYU
KIM JIN GU
DOH JAE CHEON
CHIN KENSHO
YIM SOON GYU
KIM JIN GU
DOH JAE CHEON
Application Number:
JP2012024479A
Publication Date:
May 10, 2012
Filing Date:
February 07, 2012
Export Citation:
Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01L21/60; H01L23/12
Domestic Patent References:
| JP2007305774A | 2007-11-22 | |||
| JP2003158440A | 2003-05-30 | |||
| JPS62176139A | 1987-08-01 | |||
| JPH1050886A | 1998-02-20 | |||
| JPS63237372A | 1988-10-03 | |||
| JP5159750B2 | 2013-03-13 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Masakazu Ito