Title:
SOLDER BALL SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP3254644
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve work efficiency by providing, in a recessed part for solder ball mounting, a solder ball detecting means for detecting presence of a solder ball, and detecting whether a solder ball is correctly supplied or not to an alignment block.
SOLUTION: On an alignment block 3 in which solder balls 1 used as an external electrode of a semiconductor device are aligned and then supplied to a pickup head 2, recessed parts 4 for solder ball mounting are arrayed with specified intervals. Then, a solder ball detecting means is provided to each recessed part 4, for detecting presence of solder ball. The solder ball detecting means comprises an optical fiber 5 provided on the bottom of each recessed part 4. The optical fiber 5 detects a light from a light source provided above the alignment block 3 only when the solder ball 1 is not present.
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Inventors:
Norihide Inoue
Mitsuharu Matsuda
Mitsuharu Matsuda
Application Number:
JP31787296A
Publication Date:
February 12, 2002
Filing Date:
November 28, 1996
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H05K3/34; B23K3/06; H01L21/60; (IPC1-7): H05K3/34; B23K3/06
Domestic Patent References:
| JP8264930A | ||||
| JP1302899A |
Attorney, Agent or Firm:
Takahisa Kimura
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