Title:
SOLDER BALL TRANSFER APPARATUS
Document Type and Number:
Japanese Patent JP3134688
Kind Code:
B2
Abstract:
PURPOSE: To obtain a solder ball transfer apparatus which can drop a solder ball surely at the time of mounting the solder ball.
CONSTITUTION: The solder ball transfer apparatus comprises a section for storing a solder ball 2, a section for positioning a work onto which the solder ball 2 is transferred, a suction head 15 coming into contact with the solder ball 2 through a recess 15a and suction holding/releasing the solder ball 2, and means for shifting the suction head 15 between the solder ball 2 at the solder ball storing section and a work positioned by the work positioning means. Means 16 for expanding/contracting the suction head 15 is also provided.
Inventors:
Shoji Sakemi
Application Number:
JP29837294A
Publication Date:
February 13, 2001
Filing Date:
December 01, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Domestic Patent References:
| JP5167235A | ||||
| JP5760847A | ||||
| JP5129374A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)